Highly Controlled and Customizable Thermal Expansion Materials
Protect your electronics with advanced molybdenum and tungsten-copper composites—engineered for superior thermal management.



Highly Controlled and Customizable Thermal Expansion Materials
Protect your electronics with advanced molybdenum and tungsten-copper composites—engineered for superior thermal management.

What's included in this Whitepaper?


Our thermal management materials allow for precise expansion rates and customized compositions to ensure an exact Coefficient of Thermal Expansion (CTE) match. These heat sink materials are engineered to align with the CTE of semiconductors, preventing cracking caused by uneven expansion.

Engineered using advanced wrought powder technology, our heat spreader materials deliver superior thermal conductivity. Molybdenum offers excellent thermal conductivity, while copper’s exceptional heat transfer efficiency makes it highly effective for dissipating heat.

Our composites are trusted in high-temperature applications, including heat sinks, pedestals, thermal spreaders, and base plates. Our composites are the material of choice for Gallium Arsenide (GaAs) and Gallium Nitride (GaN) semiconductors, used in applications such as microwave packages and high RF systems.

Our materials are stamped, machined, and plated and offer exceptional controlled thermal expansion up to 400°C for precise requirements.
Our molybdenum-copper material allows for customizable thermal expansion and high thermal conductivity ensuring efficient heat dissipation.
Our tungsten-copper composite is engineered for high-heat applications, offering exceptional temperature resistance while precisely controlling thermal expansion.
Available as finished parts in standard sizes up to 4 inches (102 mm) in width, 3 inches (76 mm) in thickness, and 24 inches (610 mm) in length, with custom sizes available.

